Model number： p-09

Grinding Wheels

Wafer Grinding × High-Precision Processing

Scientia supplies grinding wheels designed for semiconductor wafers and precision component processing, fully compatible with leading equipment platforms such as DISCO, OKAMOTO, and TSK. 
Each wheel can be tailored to customer process requirements, supporting a wide range of materials including silicon wafers, silicon carbide (SiC), gallium arsenide (GaAs), optical glass, and ceramics.

Key Features & Advantages

  • Equipment Compatibility: Designed for mainstream systems such as DISCO, OKAMOTO, and TSK
  • Wafer Size Support: Compatible with 8-inch and 12-inch production lines
  • Material Versatility: Suitable for Si, SiC, GaAs, optical glass, ceramics, and more
  • Multiple Grit Options: Diamond grit sizes available for both coarse and fine grinding stages
  • Short Lead Time (~1 month): Supports quick production ramp-up and reduces mass-production timelines

Applications and Compatible Grinder Models

O.D(mn) Grinder Model Mesh Size
8 inch
202~204		 DISCO(DFG840/8540...)
(200mm)		 #325-#1200
#2000-#3000
#4000-#6000
#8000~
8 inch
205		 OKAMOTO(MK-II,VG502,GNX200...)
TSK(PG200…)		 #325-#1200
#2000-#3000
#4000-#6000
#8000~
12 inch
300~304		 DISCO (DFG8560,DGP8760/8761....)
OKAMOTO(GNX300...)
TSK(PG300/PG3000...)		 #325-#1200
#2000-#3000
#4000-#6000
#80000~

Grinding Wheel Performance Comparison

Wheel Type KFMI RSL D company BT300
Specification Bond type Porous structure resin Porous structure resin
Mesh size #325 #320
Performance High easy grinding ability
Longer life time than BT300		 -Easy grinding and normal life time
Grinding ability
(max grinding current)		 8~9A 9~10A
Wheel Life ~21000 pcs ~19000 pcs
Grinding Wheels

Looking for reliable grinding wheel solutions? Get in touch today for selection guidance and sample testing programs.