Model number： p-010

Dicing Blades

Precision Cutting Solutions for Semiconductor Wafers

Scientia offers a full range of dicing blades, engineered to meet the demanding requirements of high precision and stability in semiconductor wafer dicing processes. 
From abrasive type, grit size, resin composition, to thickness parameters, each specification can be customized to match customer process needs, ensuring both cutting quality and efficiency.

Key Features & Advantages

  • Equipment Compatibility: Designed for mainstream dicing systems such as DISCO, OKAMOTO, and TSK
  • Wafer Size Support: Compatible with 8-inch and 12-inch production lines
  • Material Versatility: Suitable for diamond, SiC, resin, carbon fiber, and more
  • Multiple Grit Options: From coarse to fine, meeting requirements from rough cutting to precision finishing
  • Short Lead Time (~1 month): Accelerates production ramp-up and reduces mass-production cycles

Dicing Blade Technical Specifications

Blade XPTC POR
Item SD1500P65H P08-SD1500-BE003-75
Composition Diamond, SiC, Resin, Carbon Fiber Diamond, SiC, Resin, Carbon Fiber
Concentration 75 or others 75 or others
Diamond Grit Size 1500#/5-10pm 1500#/5-10pm
Lifetime 5° Dressing Consumption within 22±5um 5° Dressing Consumption within 22±5um
 
Dress Board XPTC POR
Model FDB-B08 WA800-NB50
Composition SiC, Resin, Carbon Fiber SiC, Resin, Carbon Fiber
Grit Size 800#/10-20pm 800#/10-20pm
Lifetime 5° Dress: 72 times; 10° Dress: 36 times 5° Dress: 72 times; 10° Dress: 36 times
 
Material Function Optimization Method
Resin Binder Optimization: Enhanced in collaboration with resin supplier, using the same formulation as DISCO.
Performance: Superior wear resistance compared to DISCO.
Diamond Primary Abrasive Optimization: Enhanced in collaboration with diamond supplier.
Performance: 1) Narrower particle size distribution for stable wear; 2) Refined processing for consistent sharpness; 3) Higher cutting efficiency.
SiC Secondary Abrasive Optimization: Precise control of silicon carbide particle size and concentration.
Performance: Blade lifespan is extended and wafer defect size and count are reduced.
Carbon Fiber Conductivity, Lubricating, Heat Dissipating Optimization: Optimizing carbon fiber content to enhance lubrication and heat dissipation.
Performance: Effectively lowers cutting resistance throughout the process.

1500-Grit Blade Performance Comparison (vs. POR)

1500 Grit Trim Blade
Item 1500 Grit  (XPTC)  Data Result POR Data Result
Outer Diameter (mm) 58.00–58.05 58.03 pass 58.00–58.05 58.04 pass
Inner Diameter (mm) 40.010–40.035 40.025 pass 40.010–40.035 40.022 pass
Warpage (mm) ≤0.30 pass pass ≤0.30 pass pass
Thickness (mm) 2.995–3.005 3.001 pass 2.990–3.010 3.010 pass
Measurement Points 12 / pass 12 / pass

Looking for reliable wafer dicing blade solutions? Get in touch today for technical data, selection guidance, and customized quotations.