Packaging & Testing
Grinding Wheels
Wafer Grinding × High-Precision Processing
Scientia supplies grinding wheels designed for semiconductor wafers and precision component processing, fully compatible with leading equipment platforms such as DISCO, OKAMOTO, and TSK.
Each wheel can be tailored to customer process requirements, supporting a wide range of materials including silicon wafers, silicon carbide (SiC), gallium arsenide (GaAs), optical glass, and ceramics.
Dicing Blades
Precision Cutting Solutions for Semiconductor Wafers
Scientia offers a full range of dicing blades, engineered to meet the demanding requirements of high precision and stability in semiconductor wafer dicing processes.
From abrasive type, grit size, resin composition, to thickness parameters, each specification can be customized to match customer process needs, ensuring both cutting quality and efficiency.